So the general rule for innovative thermal management with ceramic heat sinks is.
Ceramic vs aluminum heatsink.
In particular extruded aluminum heat sinks fit the needs of most projects.
In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.
The best practical coolers have a copper base usually heat pipes and aluminum fins.
Heat is moved by air circulation.
It s drawbacks though are weight and cost.
A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature.
Aluminum is the most common material for heat sinks.
Copper is better at heat transfer and aluminum is better at heat dissipation so good heat sinks have a copper.
The metal is lightweight and has relatively good thermal conductivity.
Ceramic coated aluminum fin heatsink improves heat dissipation to allow 16 5w for a19 led lamps taiwan puritic corporation tpc has successfully improved the aluminum fin heatsink of 10w a19 to be upgraded to 16 5w a19 via the state of the art ceramic coating and it can save significant cost.
The ceramic materials used are rubalit aluminum oxide and alunit aluminum nitride which can feature a number of different metalizations and conductor path structures if necessary even three dimensional and around the edge.
With a ceramic heat sink even if the driver fails completely mains electricity is not conducted by the heat sink and the product is safe.
Micro porous ceramic heat sinks provide a very large surface area compared to conventional copper and aluminium heat sinks.